W-Modbus reflow soldering specification¶
W-Modbus is a surface mounted device (SMD) designed to be easily integrated into high-volume production lines including reflow soldering to a PCB. It is ultimately the responsibility of the customer to choose the appropriate solder paste and to ensure oven temperatures during reflow meet the requirements of the solder paste. The W-Modbus module conforms to JSTD-020D1 standards for reflow temperatures.
Temperatures should not exceed the minimums or maximums presented in the table below
Specification | Value | Unit |
---|---|---|
Temperature Inc./Dec. Rate (max) | 3 | °C / sec |
Temperature Decrease rate (goal) | 2-3 | °C / sec |
Soak Temp Increase rate (goal) | 0.5 – 1.0 | °C / sec |
Flux Soak Period (min) | 70 | sec |
Flux Soak Period (max) | 120 | sec |
Flux Soak Temp (min) | 150 | °C |
Flux Soak Temp (max) | 190 | °C |
Time Above Liquidous (max) | 70 | sec |
Time Above Liquidous (min) | 50 | sec |
Time In Target Reflow Range (goal) | 30 | sec |
Time At Absolute Peak (max) | 5 | sec |
Liquidous Temperature (SAC305) | 218 | °C |
Lower Target Reflow Temperature | 225 | °C |
Upper Target Reflow Temperature | 250 | °C |
Absolute Peak Temperature | 260 | °C |