Reflow Soldering
TiMo reflow soldering specification¶
TiMo is a surface mounted device (SMD) designed to be easily integrated into high-volume production lines including reflow soldering to a PCB. It is ultimately the responsibility of the customer to choose the appropriate solder paste and to ensure oven temperatures during reflow meet the requirements of the solder paste. The TiMo module conforms to JSTD-020D1 standards for reflow temperatures.
Temperatures should not exceed the minimums or maximums presented in the table below
| Specification | Value | Unit |
|---|---|---|
| Temperature Inc./Dec. Rate (max) | 3 | °C / sec |
| Temperature Decrease rate (goal) | 2-3 | °C / sec |
| Soak Temp Increase rate (goal) | 0.5 – 1.0 | °C / sec |
| Flux Soak Period (min) | 70 | sec |
| Flux Soak Period (max) | 120 | sec |
| Flux Soak Temp (min) | 150 | °C |
| Flux Soak Temp (max) | 190 | °C |
| Time Above Liquidous (max) | 70 | sec |
| Time Above Liquidous (min) | 50 | sec |
| Time In Target Reflow Range (goal) | 30 | sec |
| Time At Absolute Peak (max) | 5 | sec |
| Liquidous Temperature (SAC305) | 218 | °C |
| Lower Target Reflow Temperature | 225 | °C |
| Upper Target Reflow Temperature | 250 | °C |
| Absolute Peak Temperature | 260 | °C |