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W-Modbus module reflow soldering specification

The W-Modbus module is a surface mounted device (SMD) designed for easy integration into high volume production lines using reflow soldering onto a PCB. It is ultimately the customer's responsibility to select the appropriate solder paste and to ensure that the reflow oven temperatures meet the requirements of the solder paste. The W-Modbus module complies with the JSTD-020D1 standard for reflow temperatures.

Reflow

Temperatures should not exceed the minimums or maximums presented in the table below

Specification Value Unit
Temperature Inc./Dec. Rate (max) 3 °C / sec
Temperature Decrease rate (goal) 2-3 °C / sec
Soak Temp Increase rate (goal) 0.5 – 1.0 °C / sec
Flux Soak Period (min) 70 sec
Flux Soak Period (max) 120 sec
Flux Soak Temp (min) 150 °C
Flux Soak Temp (max) 190 °C
Time Above Liquidus (max) 70 sec
Time Above Liquidus (min) 50 sec
Time In Target Reflow Range (goal) 30 sec
Time At Absolute Peak (max) 5 sec
Liquidus Temperature (SAC305) 218 °C
Lower Target Reflow Temperature 225 °C
Upper Target Reflow Temperature 250 °C
Absolute Peak Temperature 260 °C
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