Reflow soldering specification¶
The W-DALI module is a surface mounted device (SMD) designed to be easily integrated into high-volume production lines including reflow soldering to a PCB. It is ultimately the responsibility of the customer to choose the appropriate solder paste and to ensure oven temperatures during reflow meet the requirements of the solder paste. The W-DALI module conforms to JSTD-020D1 standards for reflow temperatures.
Temperatures should not exceed the minimums or maximums presented in the table below
| Specification | Value | Unit |
|---|---|---|
| Temperature Inc./Dec. rate (max) | 3 | °C/s |
| Temperature Decrease rate (target) | 2-3 | °C/s |
| Soak Temp increase rate (goal) | 0.5-1.0 | °C/s |
| Flux soak period (min) | 70 | s |
| Flux soak period (max) | 120 | s |
| Flux soak temp (min) | 150 | °C |
| Flux soak temp (max) | 190 | °C |
| Time above Liquidous (min) | 50 | s |
| Time above Liquidous (max) | 70 | s |
| Time in target reflow range (goal) | 30 | s |
| Time at absolute peak (max) | 5 | s |
| Liquidous temnperature (SAC305) | 218 | °C |
| Lower target reflow temperature | 225 | °C |
| Upper target reflow temperature | 250 | °C |
| Absolute peak temperature | 260 | °C |