W-BACnet module reflow soldering specification¶
The W-BACnet module is a surface mounted device (SMD) designed for easy integration into high volume production lines using reflow soldering onto a PCB. It is ultimately the customer's responsibility to select the appropriate solder paste and to ensure that the reflow oven temperatures meet the requirements of the solder paste. The W-BACnet module complies with the JSTD-020D1 standard for reflow temperatures.
Temperatures should not exceed the minimums or maximums presented in the table below
| Specification | Value | Unit |
|---|---|---|
| Temperature Inc./Dec. Rate (max) | 3 | °C / sec |
| Temperature Decrease rate (goal) | 2-3 | °C / sec |
| Soak Temp Increase rate (goal) | 0.5 – 1.0 | °C / sec |
| Flux Soak Period (min) | 70 | sec |
| Flux Soak Period (max) | 120 | sec |
| Flux Soak Temp (min) | 150 | °C |
| Flux Soak Temp (max) | 190 | °C |
| Time Above Liquidus (max) | 70 | sec |
| Time Above Liquidus (min) | 50 | sec |
| Time In Target Reflow Range (goal) | 30 | sec |
| Time At Absolute Peak (max) | 5 | sec |
| Liquidus Temperature (SAC305) | 218 | °C |
| Lower Target Reflow Temperature | 225 | °C |
| Upper Target Reflow Temperature | 250 | °C |
| Absolute Peak Temperature | 260 | °C |